Date
Friday, May 7, 2021
Time
1:20 PM - 1:40 PM (EDT)
Name
WITHDRAWN - ALD-CAPĀ® Encapsulation of Wafers, Devices, and Objects
Speakers
Daniel Higgs - ForgeNano
Description

Jamie Dumont, Drew Lewis, Madison Martinez, Meghan Herbert-Walters, Staci Moulton, *Daniel Higgs, Barbara Hughes, Arrelaine Dameron, Forge Nano, Louisville, CO
Atomic Layer Deposition (ALD) is a thin film technology that enables advanced materials in a wide range of applications. While ALD has grown to be an essential and widely implemented technique in two-dimensional nanoscale device manufacturing, the innovative commercial development of applications for three-dimensional and porous materials have comparatively lagged. Nevertheless, researchers around the globe have proven real advantages of ALD coatings on particles for applications including batteries, catalysts, barrier coatings, pigments, cosmetics, healthcare, and filtration. At Forge Nano, we recognize the criticality of enabling these ALD-assisted technologies for commercial applications. For the first time in history, a pathway for ALD-enhanced materials to be rapidly transitioned from lab-scale demonstration to commercial presentation is available for new product development. We will demonstrate that ALD enabled batteries are the state of the art. The high conductivity coatings developed by Forge Nano have been found to inhibit the rate of SEI layer growth on anode surfaces. The reduction in the SEI layer allows for lower impedance profiles to be maintained with the retention of power density and a higher cycle life. And higher cycle life or operation at more demanding conditions will enable the future of battery applications.

Session Type
Atomic Layer Processing