Nickel Electrodeposition Inside the Transmission Electron Microscope
Maja Koblar - Jožef Stefan Institute

*Maja Koblar1,3, Sandra Drev1, Bojan Ambrožič1, Špela Trafela1,3, Gavrilo Sekularac4, Kristina Rožman Žužek1,3, Sašo Šturm1,3, Miran Čeh1,3
1Jozef Stefan Institute, Ljubljana, Slovenia; 2Institute for Chemistry, Technology, and Metallurgy, Belgrade, Russia; 3Jožef Stefan International Postgraduate School, Ljubljana, Slovenia
Understanding the phenomenon of electrochemical deposition of metals from solutions is important for the processing of thin films. In-situ TEM analytical techniques using unique specimen holders with micro-electro-mechanical systems chip design (MEMS) comprising a three-electrode system for electrochemical studies, allow us to perform an in-situ investigation of dynamic processes of nucleation process and film growth during electrochemical deposition. Ni thin nanostructured films can be readily used as catalytic or/and sensor materials as well as for protective coatings. In our work, we studied electrochemical deposition of Ni from 1 mM and 5 mM NiSO4 aqueous solutions under varying electrochemical potential between the Pt working electrode and the Pt pseudo reference electrode. Our results showed that Ni deposition from 1 mM NiSO4 aqueous solutions resulted in nucleation and formation of dendritic metal Ni films while higher Ni concentration in solution, i.e. 5 mM, yielded uniform Ni metal film on work electrode.

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