Name
Colloquium: The Innovation Spiral of HIPIMS Towards Industrialization
Date
Monday, April 27, 2026
Time
3:40 PM - 5:00 PM
Description

Moderator: Ton Hurkmans (Chief Technology Officer (CTO), IHI Ionbond Group)

Event Description: High Power Impulse Magnetron Sputtering (HIPIMS) has emerged as a transformative technology in the field of thin film deposition, driving a dynamic industrial innovation spiral starting from advanced manufacturing tools and expanding into architectural glass, semiconductor and spreading into antimicrobial and sensor applications as more companies and research groups engage with the technology each year. The industrialization of HIPIMS is characterized by iterative advancements in plasma physics, power supply engineering, process control, and design of thin film and coating materials which enabled the realization of dense, adherent coatings with tailored properties, surpassing the limitations of conventional sputtering techniques.

A panel of experts with long track record in plasma science, industrial production and applied research will engage with the audience in an active discourse on current topics ranging from latest academic advances in plasma, process and materials science, and deployment in process development to latest industrial trends and hot topics. We are currently filling the panel seats with renowned experts from academia, applied research, and industry.

Panelists:

  • Ralf Bandorf (Head of Group, Optical and Electrical Systems, Fraunhofer IST, Germany)
  • Arutiun Ehiasarian (Head of National HIPIMS Technology Center, Sheffield Hallam University, United Kingdom)
  • Uwe Heydenreich (Key Account Manager, TRUMPF Hüttinger GmbH + Co., Germany)
  • Daniel Loch (Application Engineer, TRUMPF Hüttinger GmbH + Co., Germany)
  • Dermot P. Monaghan (Managing Director, Gencoa Ltd, United Kingdom)
  • Tetsuhide Shimizu (Associate Professor, Tokyo Metropolitan University, Japan)
Speakers
Ralf Bandorf - Fraunhofer Institute for Surface Engineering and Thin Films IST
Arutiun P. Ehiasarian - Sheffield Hallam University
Daniel Loch - TRUMPF Hüttinger GmbH & Co. KG
Ton Hurkmans - Ionbond
Uwe Heydenreich - TRUMPF Hüttinger GmbH + Co. KG
Tetsuhide Shimizu - Tokyo Metropolitan University
Dermot Monaghan - Gencoa Ltd