Microelectronic packaging, alongside leading-edge silicon technology, has consistently played a central role in enabling breakthroughs in computing. Innovations in hardware, software, and communications, together with inventions in silicon and packaging, have profoundly influenced daily life. Everyday technologies such as smartphones, smart appliances, ultra-thin laptops, cloud computing, and generative AI all benefit from these developments.

Looking ahead, continued innovations in artificial intelligence, autonomous vehicles, and next generation computing are driving an ever-increasing demand for greater computing capability. Until the mid-2010s, silicon scaling for higher transistor density and improved power and performance, combined with simpler packaging, was sufficient to meet product requirements. However, this is no longer the case.

Modern products now require a diverse array of silicon chips (IP blocks) built on different advanced technologies and large silicon real estate to deliver the necessary computing power—combining cores, accelerators, memory, and more—integrated into a single product that functions as a “single giant chip.” Future advancements center on the design and development of ecosystems composed of chiplets integrated within a package through Heterogeneous Integration. Advanced Packaging is crucial for enabling Heterogeneous Integration and, by extension, the next generation of advanced products. In this talk we will be sharing what Advanced Packaging is, how it is constructed, the challenges and future innovations.

Course Objectives:

Provide insight into what advanced packaging is, challenges in designing high performance devices and how packaging helps, packaging architecture variations and fundamentals of manufacturing processes involved. Provide students with insight into industry trends and the driving forces behind them.

Course Details / Syllabus:

• Business landscape of advanced packaging 
• Interconnect continuum
• Basics of microelectronic packaging, key technology considerations and manufacturing
• High density interconnect substrates
• Transition from single chip to multi-chip devices
• Future product vision – chiplets and heterogeneous integration
• Various packaging architectures, motivation and their application in high performance computing
• Future trends

Target Audience:

Engineering professionals who are interested in learning about what is advanced packaging, why it matters and how it’s transforming the world of computing devices.

Prerequisites: None