T. Gaag, D. Zacharias, C. Linke, E. Franzke, Plansee SE, Reutte, Austria
The semiconductor industry is accelerating toward atomic level precision and thin films deposited from sputtering targets play an essential role for achieving process stability. Plansee develops and engineers high purity sputtering targets made from molybdenum (Mo), tungsten (W), and tungsten-titanium (WTi) alloys to reflect the requirements in purity, process stability, and performance. Mo, W and its alloys are used in a wide range of applications including next generation logic and memory devices, MEMS, RF filters, EUV lithography masks, and advanced packaging. With a fully integrated value chain and powder metallurgical expertise, we present solutions for manufacturing of exceptionally dense, homogeneous targets with adopted microstructures. Examples throughout the manufacturing process of powder metallurgical sputtering targets will be presented to highlight the latest material engineering for such target materials.
Furthermore, Molybdenum oxide (MoO_ₓ ) films are in focus for low reflection layers covering fine metal lines in advanced optoelectronic devices, where high optical absorption and tunable electronic properties are essential. These films are deposited from sputter targets with complex, multi phase microstructures, yet the influence of target structure on film performance remains insufficiently understood. Crucial features of MoO_ₓ targets like phase distribution, grain morphology, electrical resistance, and surface roughness can affect sputtering behavior and related thin film properties. Systematic investigations of different target qualities have been conducted to evaluate the influence of relevant material features on the process stability.
These findings provide a framework for improved engineering MoO_ₓ targets and optimizing process stability for next generation display manufacturing.