Virginia D. Wheeler, David R. Boris, Scott G. Walton, Marc Currie, Andrew C. Lang, Neeraj Nepal, Matt Hardy, Eric Jin, Steven P. Bennett, Brian P. Downey, David J. Meyer, U.S. Naval Research Laboratory, Washington, DC
As devices continue to shrink in this technological world and approach nanoscale dimensions, requisite devices continually grow in complexity often resulting in 3D architectures, multifunctional composites, and other intricate material stacks. This reduction in size often leads to new interesting phenomena, such as quantum confinement effects in electronics or strong localization of light in nanophotonics, which can potentially enable new technological advancements in many applications. Realization of novel planar and nanostructured heterojunctions that exploit these effects often require direct integration of scalable dissimilar thin films unattainable with traditional deposition approaches. Thus, we have recently focused on developing unique deposition tools and approaches needed to enable direct integration of dissimilar epitaxial films with proper structure and properties, as well as abrupt, pristine interfaces necessary for advanced heterojunctions. In this talk, we will use several case studies based on functional oxides, dielectric coatings, and ultra wide bandgap materials to discuss the advantages and limitations of atomic layer deposition towards achieving unique heterostructures for use in optical and electronic applications.