Rodeo Winchell, Advanced Energy Industries Inc., Vancouver, WA
With the growing need for lower temperatures in thermal processing, reliable non-contact temperature measurement systems are critical. Measurement of coatings, substrates, thin-films, and materials at lower temperatures where source emission drops below desired ranges require repeatable and reliable process control. Example applications include thermal ALD, and CVD processes. Alternatively, in-situ low temperature measurements can be provided by devices that require physical contact with the measurement material or adjacent. These contact-based devices can have limitations where a non-contact method can, in some cases, overcome a number of these limitations.
Additional challenges arise in the pursuit of accurate and reliable low-temperature, non-contact measurements. Calibration of these measurement devices often require highly specialized equipment and test standards which themselves necessitate rigorous process standardization. A solid foundation in calibration methodology should be well understood by those who supply and/or maintain devices that measure temperature to a significant degree of accuracy.
This presentation covers challenges and best practices of non-contact measurements at temperatures at or below 250°C. In addition, the importance of calibrating those devices should be well understood, and the challenges associated are taken into consideration.