Name
PlasmaSolve’s Latest Developments: MatSight Suite Upgrades, Process Mining and Digital Twins in Thin Film Production
Date
Tuesday, May 20, 2025
Time
9:50 AM - 10:10 AM
Description

Adam Obrusnik, PlasmaSolve s.r.o., Brno, Czech Republic
Approaching its 9 years on the market, PlasmaSolve has become a recognized player in the thin film industry landscape. The EU-based company has revolutionized the industry by introducing high-fidelity simulations, digital twin models, and process mining components. These advancements have been instrumental to stakeholders across various sectors, including decorative, tribological, optical, and functional coatings.
The years 2024 and 2025 have been transformative years for the company, as we have released the first software product mature enough to be distributed to R&D staff and operators of thin film coating equipment and we also set up a stable representation in the USA.
This contribution provides a brief overview of PlasmaSolve’s legacy solutions but primarily highlights the new additions since the last year. These include:
• Digital twin models capable of predicting not only plasma properties but also material properties. Now available for both PVD and PECVD processes. • Process/data mining offerings that we have successfully leveraged to troubleshoot production issues within individual days.
• New functionality in our MatSight 3D Uniformity App, which now covers even more process types and has become even faster and more stable since its release early in 2024.
• Validation examples for our MatSight Target Erosion App, demonstrating how this app can shorten cathode design by up to 80% and mitigate issues such as dark shield erosion, cathode ignition problems, or insufficient target utilization.
Most of these additions will be presented via case studies with named customers, showcasing how specific challenges were solved.
These advancements demonstrate PlasmaSolve's commitment to innovation and excellence in the thin film industry.

Speakers
Adam Obrusnik - PlasmaSolve s.r.o.