R. Bandorf¹, K. Ortner¹, U. Kricheldorf¹, P.-Y. Hsie², Y.-H. Chen², J.-L. He^2
1Fraunhofer Institute for Surface Engineering and Thin Films IST, Braunschweig, Germany
²Feng Chia University, Taichung City, Taiwan
While conventional magnetron sputtering is used as a standard tool in PVD technology, hollow cathode processes are used in niche applications. Nevertheless, there is a significant number of applications, where hollow cathode processes provide an unmatched technical solution.
Fraunhofer IST provides a track record of over three decades developing and applying hollow cathode technology, especially hollow cathode gas flow sputtering. Furthermore, since one decade ago, a close cooperation and complementary development exists with the Institute of Plasma and recently the Fraunhofer Innovation Platform for Surface and Production Engineering for Optical and Electrical Systems at Feng Chia University.
The contribution will introduce the basic principle of hollow cathode processes and especially gas flow sputtering. Focus will be given on unique features like the deposition of highly porous coatings, magnetic materials (where conventional sputtering suffers from the magnetic short circuiting of the magnetron by the target material), and customized solutions. Finally, examples of successful production solutions of hollow cathode processes will be given.